Wire bond support structure and microelectronic package including wire bonds therefrom
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United States of America Patent
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Apr 17, 2018
Issued Date -
N/A
app pub date -
Jul 22, 2016
filing date -
May 30, 2014
priority date (Note) -
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Abstract
A microelectronic package may include a substrate having first and second regions, a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region; electrically conductive elements at the first surface within the second region; a support structure having a third surface and a fourth surface remote from the third surface and overlying the first surface within the second region in which the third surface faces the first surface, second and third electrically conductive elements exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements at the first surface in the first region; and wire bonds defining edge surfaces and having bases electrically connected through ones of the third conductive elements to respective ones of the second conductive elements and ends remote from the support structure and the bases.
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