HEAT SINK AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Nov 17, 2016
app pub date -
Jul 27, 2015
filing date -
May 15, 2015
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Abstract
The present disclosure provides a heat sink configured for dissipating heat from an electronic component. The heat sink includes a heat pipe and a metal board. The metal board includes a first face and a second face. An opening is defined in the metal board. The opening penetrates the first face and the second face. The heat pipe is received in the opening, and the opening is an interference fit to the heat pipe. The present disclosure also provides a method for manufacturing the heat sink described above.
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