Apparatus, system, and method for handling aligned wafer pairs
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United States of America Patent
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Nov 3, 2020
Grant Date -
Nov 17, 2016
app pub date -
May 10, 2016
filing date -
May 15, 2015
priority date (Note) -
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Abstract
An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.
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