Microstructure, multilayer wiring board, semiconductor package and microstructure manufacturing method
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United States of America Patent
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Oct 24, 2017
Grant Date -
Nov 17, 2016
app pub date -
Jul 26, 2016
filing date -
Jan 27, 2014
priority date (Note) -
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Abstract
The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.
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