Conductive connections, structures with such connections, and methods of manufacture

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10049998
APP PUB NO 20160336286A1
SERIAL NO

15221370

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.

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Patent Owner(s)

  • INVENSAS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katkar, Rajesh San Jose, US 220 4423
Uzoh, Cyprian Emeka San Jose, US 329 9032

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