MATRIX ARRANGEMENT STACKED-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Nov 24, 2016
app pub date -
Jul 27, 2015
filing date -
May 22, 2015
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Abstract
A matrix arrangement stacked-type solid electrolytic capacitor package structure includes a lead frame component, a plurality of capacitor units, and a package unit. The lead frame component includes a plurality of conductive holders arranged in matrix arrangement and a connection frame connected to the conductive holders. Each conductive holder includes a first conductive terminal and a second conductive terminal. The capacitor units are respectively disposed on the conductive holders. Each capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. Each first stacked-type capacitor has a first positive portion electrically connected to the first conductive terminal of the corresponding conductive holder and a first negative portion electrically connected to the second conductive terminal of the corresponding conductive holder. The package unit includes a plurality of package resin bodies for respectively enclosing the capacitor units.
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