Thin film surface mount components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 1, 2017
Issued Date -
N/A
app pub date -
Jul 6, 2016
filing date -
Oct 16, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.
First Claim
Family
International Classification(s)
- H01C:RESISTORS
- H03H:IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONA....
- H01F:MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF M....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H01G:CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWI....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully