Importance

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Abstract

A method of producing a power electronic assembly and a power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a bottom surface, the power electronic assembly comprises further a cooling arrangement for cooling the power electronic module, the cooling arrangement comprising a cooling surface adapted to be attached against the bottom surface of the power electronic module, wherein the power electronic assembly comprises further a thermal interface material arranged between the bottom surface of the power electronic module and the cooling surface of the cooling arrangement to transfer heat from the power electronic module to the cooling arrangement, the thermal interface material comprises an aluminium foil having a polymer coating.

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First Claim