Method of Pretreatment for Electroless Plating
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 1, 2016
app pub date -
May 28, 2015
filing date -
May 28, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method of electrolessly metal plating exposed copper or copper alloy on an article while preventing plating on areas other than the copper or copper alloy of the article to be plated. The method comprises the steps, in order, of a) immersing the article in a ruthenium based activator solution; b) immersing the article in a solution comprising one or more divalent sulfur compounds; and c) electrolessly plating the exposed copper or copper alloy on the article. The article may optionally be cleaned and/or microetched prior to being immersed in the ruthenium based activator solution. This pre treatment method eliminates extraneous plating on the article and reduces the initiation time for plating to begin on the copper or copper alloy during subsequent electroless plating.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully