Apparatus and method for treating substrate

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United States of America Patent

PATENT NO 10079142
APP PUB NO 20160351385A1
SERIAL NO

15165020

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.

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Patent Owner(s)

  • SEMES CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Dae Min Chungcheongnam-do, KR 4 3
Lee, Bok Kyu Chungcheongnam-do, KR 12 13
Lee, Jae Myoung Chungcheongnam-do, KR 37 330
Lee, Sul Incheon, KR 22 73

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