IMAGE SENSING DEVICE
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United States of America Patent
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Issued Date -
Dec 1, 2016
app pub date -
May 27, 2016
filing date -
May 28, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An image sensing device includes a printed circuit board, a chip package, and an adhesive layer. The printed circuit board has a concave portion. The chip package has a sensing surface and a bonding surface that is opposite to the sensing surface. The adhesive layer is disposed between the bonding surface of the chip package and the concave portion of the printed circuit board. The adhesive layer has an aggregation force. The chip package is bent through a surface of the concave portion and the aggregation force, such that the sensing surface of the chip package is an arc surface.
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