Multilayer electronic component
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Mar 28, 2016
filing date -
May 28, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A multilayer electronic component includes a stack and a balun. The stack includes a plurality of stacked dielectric layers and conductor layers. The balun is formed using the stack. The balun includes an unbalanced transmission line and first to fourth balanced transmission lines. The unbalanced transmission line includes a first line portion and a second line portion connected in series. The first and second balanced transmission lines are configured to be electromagnetically coupled to the first line portion. The third and fourth balanced transmission lines are configured to be electromagnetically coupled to the second line portion.
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