SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Dec 8, 2016
app pub date -
Jun 2, 2016
filing date -
Jun 3, 2015
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Abstract
Provided is a method for manufacturing a semiconductor package, which includes providing a first substrate, providing, over the first substrate, a second substrate including an active region in which a semiconductor element is disposed and a periphery region surrounding the active region, providing an adhesive membrane between the first and second substrates, and mounting the second substrate on the first substrate, wherein the mounting of the second substrate includes aligning the second substrate on the first substrate by using an alignment member protruding from the periphery region of the second substrate.
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