THREE-DIMENSIONAL CIRCUIT BOARD AND SOLDER RESIST COMPOSITION USED FOR SAME
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United States of America Patent
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Issued Date -
Dec 8, 2016
app pub date -
Jan 14, 2015
filing date -
Jan 14, 2014
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Abstract
A three-dimensional circuit board which can prevent solder flow during component mounting or a short in a circuit, and a solder resist composition used for the same. The three-dimensional circuit board includes a circuit formed on a three-dimensional board and a component mount unit. A solder resist is formed such that a component mount unit is open, and an electronic component is mounted on a component mount unit with solder. The solder resist can be a photoresist, and the three-dimensional board can be a resin molding with a circuit formed on the resin molding.
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