Importance

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Abstract

Provided are a method of fabricating an integrated digital X-ray image sensor, the method including forming a plurality of photodiode units in at least parts of a substrate having a first surface and a second surface, forming a mold on the first surface to correspond to the photodiode units, forming a microstructure having a convex part and concave parts by etching at least parts of the mold by a predetermined depth, and forming a scintillator capable of converting X-rays to a wavelength band detectable by the photodiode units, in the concave parts of the microstructure, or including forming a plurality of photodiode units in at least parts of a substrate having a first surface and a second surface, forming a microstructure having a convex part and concave parts by etching at least parts of the second surface by a predetermined depth to correspond to the photodiode units, and forming a scintillator capable of converting X-rays to a wavelength band detectable by the photodiode units, in the concave parts of the microstructure, and an integrated digital X-ray image sensor using the same.

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First Claim