METHOD AND APPARATUS FOR FORMING EMI SHIELDING LAYERS ON SEMICONDUCTOR PACKAGES
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United States of America Patent
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Issued Date -
Dec 15, 2016
app pub date -
Jun 13, 2016
filing date -
Jun 14, 2015
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Abstract
A method and apparatus for EMI shielding of an electronic package is described. The method includes applying a patterned package support to a transport tray, and placing one or more electronic packages in aligned contact with one or more open features of the patterned package support such that a peripheral region of the electronic package contacts an upper surface of the patterned package support and a central region overhangs the open feature. The method further includes depositing one or more metal layers onto the one or more electronic packages and patterned package support, wherein the open features in the patterned package support allow metal layer deposition on the sidewalls of the one or more electronic packages and protect at least a portion of the underside of the one or more electronic packages.
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