Pickoff transducer wire bond bit detection

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United States of America Patent

PATENT NO 10330719
APP PUB NO 20160370417A1
SERIAL NO

14901434

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Abstract

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A sensor device includes at least two transducers, a sensor signal processing circuit, and a transducer to sensor signal processing circuit electrical connections, each connecting a respective one of the transducers to the sensor signal processing circuit. The device also includes a differential amplifier connected with two bond wires, the bond wires connected to the differential inputs of the differential amplifier and the amplifier output connected to the sensor signal processing circuit.

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Patent Owner(s)

Patent OwnerAddress
SILICON SENSING SYSTEMS LIMITEDSOUTHWAY PLYMOUTH DEVON PL6 6DE

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Durston, Michael Terence Plymouth, GB 4 11
Sitch, Douglas Robert Plymouth, GB 5 12

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