Method for Controlling Plasma Uniformity in Plasma Processing Systems
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United States of America Patent
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Dec 22, 2016
app pub date -
Nov 18, 2015
filing date -
Jun 18, 2015
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Abstract
Techniques herein include a method for generating uniform plasma within an inductively-coupled plasma reactor. Techniques herein include providing a termination capacitor that is dynamically adjustable to adjust a termination capacitor value to provide a uniform E-field distribution in the reactor via a time-averaged uniformity. During a given plasma processing operation, a termination capacitor can be continuously changed to create various rotational cycles so that a given substrate received uniform treatment.
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