Auto-correction of electrostatic chuck temperature non-uniformity
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United States of America Patent
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Aug 13, 2019
Grant Date -
Dec 22, 2016
app pub date -
Sep 21, 2015
filing date -
Jun 22, 2015
priority date (Note) -
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Abstract
A system for controlling a temperature of a wafer processing substrate includes memory that stores first data indicative of first temperature responses of at least one first thermal control element. The first data corresponds to the first temperature responses as observed when a first control parameter of the at least one first thermal control element is maintained at a first predetermined first value. A first controller receives a setpoint temperature for the wafer processing substrate and maintains the first control parameter of the at least one first thermal control element at a second value based on the received setpoint temperature. A second controller retrieves the first data from the memory, calculates second data indicative of temperature non-uniformities associated with the wafer processing substrate based on the first data and the second value, and controls a plurality of second thermal control elements based on the calculated second data.
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