INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES
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United States of America Patent
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app pub date -
Sep 1, 2016
filing date -
Feb 26, 2013
priority date (Note) -
Abandoned
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Abstract
An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.
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