Integrated package design with wire leads for package-on-package product
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United States of America Patent
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May 1, 2018
Issued Date -
N/A
app pub date -
Dec 23, 2014
filing date -
Dec 23, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated package design for a package-on-package product is described that uses wire leads. Some embodiments pertain to a stacked package assembly that includes a first die having a front side and a back side, a die paddle attached to the back side of the first die, a plurality of wire leads, one end being connected to the front side of the die for connection to an external device, a mold compound encapsulating the first die and at least a portion of the die paddle, a land pad cut from the die paddle and supported by the mold compound, a second plurality of wire leads, one end of the wire leads being connected to the front side of the first die and the other end of the wire leads being connected to the land pad, a second die stacked over the die paddle and a third plurality of wire leads, one end being connected to the second die and the other end being connected to the land pad.
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