Conductive pillar shaped for solder confinement

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United States of America Patent

PATENT NO 9583451
SERIAL NO

14744495

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Abstract

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Pillar-type connections and methods for fabricating a pillar-type connection. A conductive layer is formed on a bond pad. A second conductive layer is formed on the first conductive layer to define a conductive pillar. The conductive pillar includes a non-planar top surface defining a recess. The recess may receive a portion of a solder body used to connect the conductive pillar with a package.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arvin, Charles L Savannah, US 153 712
Gambino, Jeffrey P Portland, US 531 7330
Muzzy, Christopher D Burlington, US 130 1008
Sauter, Wolfgang Eagle-Vail, US 189 1600

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