FLUID FLOW IN A TEMPERATURE CONTROL ACTUATOR FOR SEMICONDUCTOR DEVICE TEST
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United States of America Patent
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Issued Date -
Dec 29, 2016
app pub date -
Jun 24, 2015
filing date -
Jun 24, 2015
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Abstract
Improved fluid flow is described for a temperature control actuator that is used in semiconductor device test. In one example, the apparatus includes a top plate configured to thermally connect to a semiconductor device under test, a channel plate thermally connected to the top plate and having a plurality of fluid channels to receive a thermally controlled fluid from an inlet to exchange heat with the thermally controlled fluid in the channel and to eliminate the thermally controlled fluid to an outlet, a manifold to provide the thermally controlled fluid to the inlet and to receive the thermally controlled fluid through the outlet, and a flow guide in the channel thermally connected to the top plate.
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