Importance

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Abstract

An optical module includes a high-thermal-expansion ceramic substrate on which is mounted a planar lightwave circuit as well as at least one device component. The high-thermal-expansion ceramic substrate may be used in conjunction with a high-thermal-expansion metal in order to reduce thermal stress produced from the mismatch of thermal properties within the optical module. The high-thermal-expansion ceramic substrate may also be part of an optical module package which includes a die attach area, on which at least one device can be mounted, and a circuit pattern which electrically connects the at least one device to other at least one device components. A high-thermal-expansion metal may also be used with the high-thermal-expansion ceramic substrate in order to reduce the thermal stress that would otherwise exist in the optical module package.

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First Claim