Compact via structures and method of making same

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United States of America Patent

PATENT NO 10249924
APP PUB NO 20160378215A1
SERIAL NO

14752642

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Techniques and mechanisms to provide a compact arrangement of vias extending through at least a portion of a printed circuit board (PCB) or other substrate. In an embodiment, the substrate includes a dielectric material and a sidewall structure forming a hole region that extends at least partially through the dielectric material. The hole region adjoins each of a first via and a second via, and is also located between the first via and second via. In another embodiment, the first via is coupled to exchange a first signal of a differential signal pair, and the second via is coupled to exchange a second signal of the same differential signal pair.

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Patent Owner(s)

  • INTEL CORP.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Enriquez, Shibayama Raul Zapopan, MX 18 43
Guillen, Gonzalez Jose Diego Guadalajara, MX 1 2
Lee, Beom-Taek Mountain View, US 27 72
Ouyang, Gong Olympia, US 14 38
Xiao, Kai University Place, US 169 594

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