Low resistance metal contacts to interconnects

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United States of America Patent

PATENT NO 9786550
SERIAL NO

14749811

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Abstract

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A semiconductor device and a method of fabricating a contact to interface with an interconnect in a semiconductor device are described. The device includes a dielectric layer formed on a semiconductor layer, and a contact fabricated in a via formed within the dielectric layer. An interconnect formed above the contact interfaces with an exposed surface of the contact opposite a surface closest to the semiconductor layer. The contact includes a contact material in a first portion of the contact and an interface metal in a second portion of the contact.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fritz, Gregory M Wakefield, US 35 370
Gates, Stephen M Ossining, US 111 4161
Joseph, Eric A White Plains, US 95 825
Spooner, Terry A Clifton Park, US 91 1106

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