Structures and methods for reliable packages

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9741620
APP PUB NO 20160379885A1
SERIAL NO

14749529

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.

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Patent Owner(s)

  • INVENSAS CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Guilian San Jose, US 126 2722
Shen, Hong Palo Alto, US 238 3088
Sitaram, Arkalgud R Cupertino, US 62 1392
Uzoh, Cyprian Emeka San Jose, US 329 9032
Wang, Liang Milpitas, US 567 4748

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