IMAGE SENSOR CHIP PACKAGE AND FABRICATING METHOD THEREOF
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United States of America Patent
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Issued Date -
Dec 29, 2016
app pub date -
Sep 9, 2016
filing date -
Jan 10, 2013
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Abstract
A method for fabricating an image sensor chip package begins at providing a wafer, which includes forming a plurality of image sensor components on a substrate, forming a plurality of spacers on the substrate for separating the image sensor components, and disposing a transparent plate on the spacers. The method further includes forming a plurality of stress notches on the transparent plate. After the stress notches are formed, the transparent plate is pressed and the substrate is cut at the second chambers. The transparent plate is broken along the stress notches.
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