LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount
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United States of America Patent
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app pub date -
Sep 8, 2016
filing date -
Feb 18, 2013
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Abandoned
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Abstract
A light emitting device manufacturing method includes the following steps. A sub-mount, which has a plurality of electrical-conductive layers, is provided, and a surface between every adjacent two of the electrical-conductive layers has an adhesive-filling groove. An LED chip, which has a bottom substrate, is mounted on the sub-mount by a flip-chip way, and two electrodes of the LED chip are in contact with adjacent two of the electrical-conductive layers. Glue is filled along the adhesive-filling groove to be guided into a gap between the LED chip and the sub-mount.
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