Methods of forming trenches in packages structures and structures formed thereby

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United States of America Patent

PATENT NO 10231338
APP PUB NO 20160381800A1
SERIAL NO

14748496

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods of forming a package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one interconnect structure disposed on a peripheral region of the first substrate. A molding compound is disposed on a portion of the first substrate and on the first die, wherein a trench opening is disposed in the molding compound that is located between the at least one interconnect structure and the first die.

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Patent Owner(s)

  • INTEL CORP.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fei, Huiyang Chandler, US 5 24
Malatkar, Pramod Chandler, US 50 398
Nickerson, Robert Chandler, US 28 254
Raghavan, Prasanna Chandler, US 6 37
Yagnamurthy, Naga Sivakumar Chandler, US 4 19

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