PASSIVE PLACEMENT OF A LASER ON A PHOTONIC CHIP

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170003463A1
SERIAL NO

14790925

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments disclosed herein generally relate to a method for manufacturing a photonic device that facilitates precise alignment of a laser with a waveguide. The method generally includes disposing the laser on a support member on a substrate such that the laser contacts the support member. The support member may extend in a direction perpendicular to a base plane of the substrate, and solder may be disposed on the base plane such that a height of the solder in the direction perpendicular to the base plane is less than a height of the support member so that a gap is created between the solder and the laser. Once the laser has been properly aligned with the waveguide, the solder may be heated (e.g., reflowed) so that the solder contacts the laser.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
CISCO TECHNOLOGY, INC.SAN JOSE, CA14366

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DAUGHERTY, Thomas Allentown, US 3 6
NADEAU, Mary Alburtis, US 9 75
PATEL, Vipulkumar Breinigsville, US 79 785
TUMMIDI, Ravi Sekhar Breinigsville, US 10 17

Cited Art Landscape

Patent Info (Count) # Cites Year
 
TYCO ELECTRONICS CORPORATION (1)
* 6625357 Method for fabricating fiducials for passive alignment of opto-electronic devices 6 2001
* Cited By Examiner

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