Flat No-Leads Package With Improved Contact Pins
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United States of America Patent
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app pub date -
Sep 12, 2016
filing date -
Nov 20, 2014
priority date (Note) -
Abandoned
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Abstract
According to an embodiment of the present disclosure, a leadframe for an integrated circuit (IC) device may comprise a center support structure for mounting an IC chip, a plurality of pins extending from the center support structure, and a bar connecting the plurality of pins remote from the center support structure. Each pin of the plurality of pins may include a dimple.
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