CHEMICAL MECHANICAL PLANARIZATION CONDITIONER

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United States of America Patent

APP PUB NO 20170008146A1
SERIAL NO

15193604

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Abstract

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A device and method of breaking in a chemical mechanical planarization (CMP) polishing pad using multiple pad conditioners to break-in and maintain a condition of the polishing pad.

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Patent Owner(s)

Patent OwnerAddress
ABRASIVE TECHNOLOGY INC8400 GREEN MEADOWS DRIVE WESTERVILLE OH 43081

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bubnick, Mark Lewis Center, US 1 1
Diaz, Mark Kevin Chandler, US 1 1
Namola, Thomas S Columbus, US 1 1

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