Glass Substrate Cutting Apparatus and Cutting Method Thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170008794A1
SERIAL NO

14647117

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The invention provides a glass substrate cutting apparatus, comprising workbenches, cutting knives and rollers, wherein a glass substrate is transferred on the workbenches; the cutting knives comprise an upper cutting knife and a lower cutting knife that are arranged the upper end and the lower end of the glass substrate respectively with knife edges opposite to each other, so as to cut the glass substrate into two halves from the upper side and the lower side of the glass substrate; the rollers are arranged at the upper end of the glass substrate; and the glass substrate can be pressed to break down along a cutting crack on the glass substrate. The cutting apparatus further comprises high-pressure nozzles that are arranged between the cutting knifes and the rollers and can eject a high-pressure airflow along the cutting crack so as to accelerate the breakage of the glass substrate.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTDNO 9-2 TANGMING RD GUANGMING NEW DISTRICT SHENZHEN GUANGDONG 518132

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JIA, Huping Shenzhen, Guangdong, CN 5 10

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