POLYOLEFIN RESIN COMPOSITION FOR HOT MELT ADHESIVE, HOT MELT ADHESIVE FILM, AND LAMINATE
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United States of America Patent
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Issued Date -
Jan 12, 2017
app pub date -
Jan 15, 2015
filing date -
Jan 22, 2014
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Abstract
A polyolefin resin composition for hot melt adhesives includes 5 to 95% by weight of (A) an ethylene-α-olefin copolymer having a melting point of at least 100° C. but not more than 140° C.; and 5 to 95% by weight of (B) an ethylene-α-olefin copolymer having a melting point of at least 70° C. but less than 100° C.
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