THIN VAPOR CHAMBER AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Jan 12, 2017
app pub date -
Jul 9, 2015
filing date -
Jul 9, 2015
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Abstract
A thin vapor chamber includes a heat conducting plate having an upper surface, a metal cover sealed and covering on the heat conducting plate, and a wick structure disposed between the heat conducting plate and the metal cover. A plurality of hollow supports are formed on the metal cover by pressing and face the heat conducting plate. The wick structure is provided with plural throughholes. The hollow supports are individually disposed through the corresponding throughholes and attached to the upper surface. Thus, the heat of the heat conducting plate is transferred to the metal cover through the hollow supports. Besides, the metal cover is pressed to have an uneven shape to increase heat-dissipating area and structural strength, which achieves excellent heat transfer efficiency and heat diffusion of the thin vapor chamber.
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