SEMICONDUCTOR DEVICE PACKAGE HAVING AN OSCILLATOR AND AN APPARATUS HAVING THE SAME
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United States of America Patent
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Mar 1, 2016
filing date -
Jul 9, 2015
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Abstract
A semiconductor device package includes a substrate including, on an edge thereof, a connector that is connectable to a host, a nonvolatile semiconductor memory device disposed on a surface of the substrate, a memory controller disposed on the surface of the substrate, an oscillator disposed on the surface of the substrate and electrically connected to the memory controller, and a seal member sealing the nonvolatile semiconductor memory device, the memory controller, and the oscillator on the surface of the substrate.
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