Semiconductor memory device and method for manufacturing the same

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United States of America Patent

PATENT NO 9735167
SERIAL NO

14840345

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Abstract

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A semiconductor memory device according to one embodiment, includes a plurality of first interconnects extending in a first direction and arrayed along a second direction crossing the first direction, a plurality of semiconductor pillars arrayed in a row along the first direction in each of spaces among the first interconnects and extending in a third direction crossing the first direction and the second direction, a first electrode disposed between one of the semiconductor pillars and one of the first interconnects, a first insulating film disposed between the first electrode and one of the first interconnects, a first insulating member disposed between the semiconductor pillars in the first direction and extending in the third direction and opposed the first interconnects not via the first insulating film.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Fumitaka Yokkaichi, JP 234 5189
Kato, Tatsuya Yokkaichi, JP 200 2193
Kikutani, Keisuke Yokkaichi, JP 29 130
Murakoshi, Atsushi Yokkaichi, JP 51 1014
Nagashima, Satoshi Yokkaichi, JP 95 480
Sekine, Katsuyuki Yokkaichi, JP 124 1813
Watanabe, Yuta Yokkaichi, JP 104 401

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