Stacked semiconductor device assembly in computer system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10114775
APP PUB NO 20170017594A1
SERIAL NO

15277949

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Abstract

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This application is directed to a stacked semiconductor device assembly including first and second integrated circuit (IC) devices. Each of the first and second IC devices further includes a master interface, a channel master circuit configured to receive read/write data using the master interface, a slave interface, a channel slave circuit configured to receive read/write data using the slave interface, a memory core coupled to the channel salve circuit, and a modal pad. The first and second IC devices are configured such that in response to at least a modal selection signal received at one of the modal pads of the first and second IC devices, one of the first and second IC devices is configured to receive read/write data using its respective charnel master circuit, and the other of the first and second IC devices is configured to receive read/write data using its respective channel slave circuit.

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Patent Owner(s)

  • RAMBUS INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Best, Scott C Palo Alto, US 184 3250

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