SEMIAROMATIC POLYAMIDE RESIN COMPOSITION AND FORMED BODY OBTAINED BY FORMING SAME

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United States of America Patent

APP PUB NO 20170022349A1
SERIAL NO

15301729

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Abstract

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Disclosed is a semiaromatic polyamide resin composition including a semiaromatic polyamide (A) and a polyhydric alcohol (B), wherein a mass ratio (A/B) between the semiaromatic polyamide (A) and the polyhydric alcohol (B) is 99.95/0.05 to 90/10; and the semiaromatic polyamide (A) includes as constituent components thereof an aromatic dicarboxylic acid component and an aliphatic diamine component, and has a melting point of 300 to 350° C.

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Patent Owner(s)

Patent OwnerAddress
UNITIKA LTD1-50 HIGASHIHONMACHI AMAGASAKI-SHI HYOGO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AMARI, Taiyo Kyoto, JP 4 14
KAMIKAWA, Hiroo Kyoto, JP 18 76
MII, Junichi Kyoto, JP 4 14

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