THERMALLY ENHANCED FACE-TO-FACE SEMICONDUCTOR ASSEMBLY WITH HEAT SPREADER AND METHOD OF MAKING THE SAME
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United States of America Patent
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Issued Date -
Jan 26, 2017
app pub date -
Oct 8, 2016
filing date -
May 27, 2015
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Abstract
A face-to-face semiconductor assembly is characterized in that an encapsulated device having a first semiconductor chip surrounded by an array of vertical connecting elements in an encapsulant is stacked on and electrically coupled to a thermally enhanced device having a second semiconductor chip accommodated in a cavity of a thermal board. The first and second semiconductor chips are face-to-face mounted on two opposite sides of a first routing circuitry and is further electrically connected to the vertical connecting elements through the first routing circuitry. The thermal board has a heat spreader to provide thermal dissipation for the second semiconductor chip. The first routing circuitry provides primary fan-out routing for the first and second semiconductor chips, whereas the vertical connecting elements provide electrical contacts for next-level connection.
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