APPARATUS AND METHOD FOR SOLDERING JOINING PARTNERS, SAID APPARATUS COMPRISING A VACUUM CHAMBER AND PLATE ELEMENTS

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United States of America Patent

SERIAL NO

15300818

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Abstract

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The invention describes an apparatus and a method for soldering mating parts, in particular electrical components to circuit boards or other carrier elements. The mating parts may be received and pressed together between two plate elements. One of the plate elements, which is heatable, may be flexible and may be elastically biased in the direction of the other plate element, by means of a plurality of elastically biased elements. Alternatively or additionally, heating may be provided for both plate elements.

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Patent Owner(s)

Patent OwnerAddress
CENTROTHERM PHOTOVOLTAICS AGJOHANNES-SCHMID-STR 8 BLAUBEUREN D-89143

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lenz, Reinhard Blaubeuren, DE 7 17
Usenbenz, Matthias Heroldstatt, DE 1 1

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