System and method for wafer alignment and centering with CCD camera and robot

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United States of America Patent

PATENT NO 9966290
SERIAL NO

14813895

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Abstract

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A wafer alignment system includes an image capture module that captures an image of a wafer positioned on a robot. An image analysis module analyzes the image to determine a position of the wafer on the robot. A position correction module calculates adjustment data based on the determined position of the wafer on the robot. A system control module controls the robot to at least one of place the wafer and retrieve the wafer based on the calculated adjustment data and a nominal position of the wafer on the robot.

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Patent Owner(s)

  • LAM RESEARCH CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Senn, Brandon Molalla, US 7 48

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