Copper Electrodeposition in Microelectronics

United States of America Patent

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Feb 2, 2017
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Oct 12, 2016
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Mar 5, 2002

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Abstract

A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a a quaternized pyridinium salt compound for leveling.

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Inventor Name	Address	# of filed Patents	Total Citations
Figura, Paul	Orange, US	10	136
Hurtubise, Richard	Clinton, US	35	310
Lin, Xuan	Watervilet, US	36	416
Paneccasio,, JR Vincent	Madison, US	25	150

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Copper Electrodeposition in Microelectronics

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United States of America Patent

15291340

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