Importance

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Abstract

Various types of optoelectronic components are housed inside a standard TO-can package. In a first exemplary embodiment, a sub-assembly is mounted on a substrate of a TO-can package such that a major surface of the sub-assembly is oriented orthogonal to a major surface of the substrate. The sub-assembly includes a light emitter and a light directing element that is arranged at a fixed distance from the light emitter prior to mounting of the sub-assembly on the substrate. The fixed distance is based on a first mounted distance formed between the light directing element and an optical window of the TO-can package when the sub-assembly is mounted on the substrate. In a second exemplary embodiment, a planar lightwave circuit incorporating an optical waveguide combiner, is mounted on the substrate of a TO-can package. The planar lightwave circuit includes two light emitters emitting light at different wavelengths into the optical waveguide combiner.

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First Claim