Connection patterns for high-density device packaging

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United States of America Patent

PATENT NO 9824978
APP PUB NO 20170033054A1
SERIAL NO

14820195

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Connection patterns for device packaging allow high density circuitry dies to be assembled into packages of manufacturable size. The connection patterns may be patterns for solder ball arrays or other types of connection mechanisms under a semiconductor package. Despite the increased density of the connection patterns, the connection patterns meet the demanding crosstalk specifications for high speed operation of the high density circuitry.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ramakrishnan, Arun Irvine, US 79 543

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