Face-to-face semiconductor assembly having semiconductor device in dielectric recess
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 9, 2018
Grant Date -
Feb 2, 2017
app pub date -
Dec 31, 2015
filing date -
Jul 28, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A face-to-face semiconductor assembly is characterized by a semiconductor device positioned in a dielectric recess of a core base and surrounded by an array of metal posts. The recess in the core provides lateral displacement control between the device and the metal posts, and the minimal height of the metal posts needed for the vertical connection between both opposite sides of the core base can be reduced by the amount equal to the depth of the recess. Further, the semiconductor device is face-to-face electrically coupled to another semiconductor device through a buildup circuitry therebetween.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully