Overmolded ink delivery device

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United States of America Patent

PATENT NO 10016983
SERIAL NO

15304767

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Abstract

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An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.

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Patent Owner(s)

  • HEWLETT-PACKARD COMPANY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hua Corvallis, US 404 2915
Cumbie, Michael W Albany, US 269 892
Mourey, Devin Alexander Albany, US 34 96

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