METHOD OF IMPROVING LIFETIME OF ETCHING LIQUID AND YIELD IN CU-INTERCONNECTION PROCESS AND CU-INTERCONNECTION ETCHING DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Oct 19, 2016
filing date -
Dec 18, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A Cu-interconnection etching device includes an etching liquid tank containing therein an etching liquid that is a hydrogen peroxide based solution, a first concentration monitoring device receiving the etching liquid from the etching liquid tank and measuring a copper ion concentration of the etching liquid. The etching liquid is supplied through a filter assembly that filters off copper ions contained in the etching liquid so as to provide a filtered etching liquid. The filter etching liquid is supplied through a second concentration monitoring device that measures a copper ion concentration of the filtered etching liquid and conducts the filtered etching liquid back to the etching liquid tank. A variation between the measurements of the first and second concentration monitoring devices is used to control the operation of the filter assembly in order to maintain a proper level of copper ion concentration in the etching liquid.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully