Shape memory material based thermal coupler/decoupler and method

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United States of America Patent

PATENT NO 10267578
APP PUB NO 20170038159A1
SERIAL NO

14818177

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Abstract

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A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.

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Patent Owner(s)

Patent OwnerAddress
RAYTHEON COMPANY870 WINTER STREET WALTHAM MA 02451-1449

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bersbach, Charles J Tucson, US 2 11
Wood, Adam C Oro Valley, US 10 18

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